Issued Patents 2022
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527499 | Integrated fan-out structures and methods for forming the same | Tsui-Mei Chen, Tsung-Jen Liao, Pei-Haw Tsao | 2022-12-13 |
| 11404383 | Magnetic shielding material with insulator-coated ferromagnetic particles | Tsung-Hsing Lu, Pei-Haw Tsao | 2022-08-02 |
| 11342291 | Semiconductor packages with crack preventing structure | Yao-Chun Chuang, Hong-Seng Shue, Chen-Nan Chiu, Mirng-Ji Lii | 2022-05-24 |
| 11315860 | Semiconductor package and manufacturing process thereof | Hsu-Hsien Chen, Liang-Chen Lin, Tsung-Yang Hsieh, Hsin-Hsien Lee, Kuen-Hong Tsai | 2022-04-26 |
| 11239143 | Semiconductor structure and manufacturing method thereof | Pei-Haw Tsao, Tsung-Hsing Lu | 2022-02-01 |
| 11240947 | Carrier tape system and components and methods of use | Sung-Sheng Chiu, Pei-Haw Tsao, Tsui-Mei Chen, Shih-Hsing Lin | 2022-02-01 |