Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11315860 | Semiconductor package and manufacturing process thereof | Li-Huan Chu, Hsu-Hsien Chen, Tsung-Yang Hsieh, Hsin-Hsien Lee, Kuen-Hong Tsai | 2022-04-26 |
| 11226363 | Reliability testing method and apparatus | Shiang-Ruei Su, Chia-Wei Tu | 2022-01-18 |