Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11315860 | Semiconductor package and manufacturing process thereof | Li-Huan Chu, Liang-Chen Lin, Tsung-Yang Hsieh, Hsin-Hsien Lee, Kuen-Hong Tsai | 2022-04-26 |
HC
Hsu-Hsien Chen
Overall (2022): #428,861 of 548,613Top 80%
1
Patents 2022