Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11315860 | Semiconductor package and manufacturing process thereof | Li-Huan Chu, Hsu-Hsien Chen, Liang-Chen Lin, Hsin-Hsien Lee, Kuen-Hong Tsai | 2022-04-26 |
TH
Tsung-Yang Hsieh
Overall (2022): #224,134 of 548,613Top 45%
1
Patents 2022