Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11302654 | Method of fabricating semiconductor device including dummy via anchored to dummy metal layer | Jian-Hong Lin, Kuo-Yen Liu, Hsin Chang, Yu-Ching Lee, Yih Wang | 2022-04-12 |
| 11222857 | Method of forming a photoresist over a bond pad to mitigate bond pad corrosion | Chih-Fan Huang, Dian-Hau Chen, Mao-Nan Wang, Yen-Ming Chen, Tzung-Luen Li | 2022-01-11 |