Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11302654 | Method of fabricating semiconductor device including dummy via anchored to dummy metal layer | Jian-Hong Lin, Kuo-Yen Liu, Tzu-Li Lee, Yu-Ching Lee, Yih Wang | 2022-04-12 |