Issued Patents 2022
Showing 1–25 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532518 | Slot contacts and method forming same | Lin-Yu Huang, Sheng-Tsung Wang, Jia-Chuan You, Chia-Hao Chang, Tien-Lu Lin +2 more | 2022-12-20 |
| 11532714 | Semiconductor device and method of forming thereof | Huan-Chieh Su, Lin-Yu Huang, Cheng-Chi Chuang, Chih-Hao Wang | 2022-12-20 |
| 11532713 | Source/drain contacts and methods of forming same | Huan-Chieh Su, Lin-Yu Huang, Cheng-Chi Chuang, Chih-Hao Wang | 2022-12-20 |
| 11508615 | Semiconductor device structure and methods of forming the same | Lin-Yu Huang, Chia-Hao Chang, Cheng-Chi Chuang, Kuan-Lun Cheng, Chih-Hao Wang | 2022-11-22 |
| 11502201 | Semiconductor device with backside power rail and methods of fabrication thereof | Huan-Chieh Su, Shih-Chuan Chiu, Lin-Yu Huang, Cheng-Chi Chuang, Chih-Hao Wang | 2022-11-15 |
| 11482594 | Semiconductor devices with backside power rail and method thereof | Huan-Chieh Su, Lin-Yu Huang, Cheng-Chi Chuang, Chih-Hao Wang | 2022-10-25 |
| 11482595 | Dual side contact structures in semiconductor devices | Shih-Chuan Chiu, Chia-Hao Chang, Cheng-Chi Chuang, Chih-Hao Wang, Huan-Chieh Su +2 more | 2022-10-25 |
| 11456209 | Spacers for semiconductor devices including a backside power rails | Huan-Chieh Su, Lin-Yu Huang, Cheng-Chi Chuang, Chih-Hao Wang | 2022-09-27 |
| 11456246 | Semiconductor device structure and methods of forming the same | Lin-Yu Huang, Chia-Hao Chang, Cheng-Chi Chuang, Kuan-Lun Cheng, Chih-Hao Wang | 2022-09-27 |
| 11450751 | Integrated circuit structure with backside via rail | Huan-Chieh Su, Chun-Yuan Chen, Cheng-Chi Chuang, Shang-Wen Chang, Yi-Hsun Chiu +3 more | 2022-09-20 |
| 11444173 | Semiconductor device structure with salicide layer and method for forming the same | Hsiang-Ku Shen, Jin-Mu Yin, Tsung-Chieh Hsiao, Chia-Lin Chuang, Dian-Hau Chen +14 more | 2022-09-13 |
| 11437279 | Method for fabricating a semiconductor device | Chun-Yuan Chen, Huan-Chieh Su, Lo-Heng Chang, Cheng-Chi Chuang, Chih-Hao Wang | 2022-09-06 |
| 11424332 | Gap spacer for backside contact structure | Lin-Yu Huang, Kuan-Lun Cheng, Chih-Hao Wang | 2022-08-23 |
| 11410876 | Semiconductor device with air gaps and method of fabrication thereof | Chia-Hao Chang, Lin-Yu Huang, Cheng-Chi Chuang, Kuan-Lun Cheng, Chih-Hao Wang | 2022-08-09 |
| 11404548 | Capacitance reduction for backside power rail device | Cheng-Chi Chuang, Chih-Hao Wang, Huan-Chieh Su, Lin-Yu Huang | 2022-08-02 |
| 11387140 | Enlarging contact area and process window for a contact via | Cheng-Chi Chuang, Chih-Hao Wang, Yu-Ming Lin, Lin-Yu Huang | 2022-07-12 |
| 11374093 | Semiconductor device structure and methods of forming the same | Lin-Yu Huang, Cheng-Chi Chuang, Kuan-Lun Cheng, Chih-Hao Wang | 2022-06-28 |
| 11361986 | Using a liner layer to enlarge process window for a contact via | Cheng-Chi Chuang, Chih-Hao Wang, Yu-Ming Lin, Lin-Yu Huang | 2022-06-14 |
| 11349004 | Backside vias in semiconductor device | Huan-Chieh Su, Lin-Yu Huang, Cheng-Chi Chuang, Chih-Hao Wang | 2022-05-31 |
| 11342413 | Selective liner on backside via and method thereof | Lin-Yu Huang, Chia-Hao Chang, Cheng-Chi Chuang, Kuan-Lun Cheng, Chih-Hao Wang | 2022-05-24 |
| 11328990 | Via structure having a metal hump for low interface resistance | Lin-Yu Huang, Cheng-Chi Chuang, Yu-Ming Lin, Chih-Hao Wang | 2022-05-10 |
| 11316023 | Dumbbell shaped self-aligned capping layer over source/drain contacts and method thereof | Lin-Yu Huang, Chia-Hao Chang, Cheng-Chi Chuang, Kuan-Lun Cheng, Chih-Hao Wang | 2022-04-26 |
| 11309212 | Semiconductor device structure and methods of forming the same | Lin-Yu Huang, Chia-Hao Chang, Cheng-Chi Chuang, Kuan-Lun Cheng, Chih-Hao Wang | 2022-04-19 |
| 11264326 | Contact via formation | Lin-Yu Huang, Kuan-Lun Cheng, Chih-Hao Wang, Cheng-Chi Chuang, Chia-Hao Chang | 2022-03-01 |
| 11257758 | Backside connection structures for nanostructures and methods of forming the same | Chia-Hao Chang, Lin-Yu Huang, Cheng-Chi Chuang, Chih-Hao Wang | 2022-02-22 |