Issued Patents 2022
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532518 | Slot contacts and method forming same | Lin-Yu Huang, Li-Zhen Yu, Sheng-Tsung Wang, Jia-Chuan You, Chia-Hao Chang +2 more | 2022-12-20 |
| 11508622 | Semiconductor device structure with tapered contact and method for forming the same | Lin-Yu Huang, Sheng-Tsung Wang, Jia-Chuan You, Chia-Hao Chang, Yu-Ming Lin +1 more | 2022-11-22 |
| 11495539 | Interconnect structure with air-gaps | Tai-I Yang, Cheng-Chi Chuang, Yung-Chih Wang | 2022-11-08 |
| 11476196 | Semiconductor device with multi-layer dielectric | Lin-Yu Huang, Sheng-Tsung Wang, Jia-Chuan You, Chia-Hao Chang, Yu-Ming Lin +1 more | 2022-10-18 |
| 11342229 | Method for forming a semiconductor device structure having an electrical connection structure | Shih-Chuan Chiu, Jia-Chuan You, Chia-Hao Chang, Chun-Yuan Chen, Yu-Ming Lin +1 more | 2022-05-24 |
| 11335592 | Contact resistance between via and conductive line | Chun-Yuan Chen, Shih-Chuan Chiu, Jia-Chuan You, Chia-Hao Chang, Yu-Ming Lin | 2022-05-17 |
| 11282920 | Semiconductor device with air gap on gate structure and method for forming the same | Che-Chen Wu, Chia-Lin Chuang, Yu-Ming Lin, Chih-Hao Chang | 2022-03-22 |
| 11264284 | Semiconductor device and method of fabricating the same | Jia-Chuan You, Chia-Hao Chang, Yu-Ming Lin, Chih-Hao Wang | 2022-03-01 |
| 11244899 | Butted contacts and methods of fabricating the same in semiconductor devices | Jia-Chuan You, Chia-Hao Chang, Yu-Ming Lin, Chih-Hao Wang | 2022-02-08 |
| 11239340 | Semiconductor arrangement and formation thereof | Tai-I Yang, Wai-Yi Lien, Chih-Hao Wang, Jiun-Peng Wu | 2022-02-01 |
| 11239106 | Source/drain isolation structure and methods thereof | Lin-Yu Huang, Sheng-Tsung Wang, Chia-Hao Chang, Yu-Ming Lin, Chih-Hao Wang | 2022-02-01 |
| 11217480 | Semiconductor structure with a laminated layer | Chia-Lin Chuang, Chia-Hao Chang, Sheng-Tsung Wang, Lin-Yu Huang, Yu-Ming Lin +1 more | 2022-01-04 |