Issued Patents 2022
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11502196 | Stress modulation for dielectric layers | Chung-Ting Ko, Han-Chi Lin, Chunyao Wang, Ching-Yu Huang, Tze-Liang Lee | 2022-11-15 |
| 11495539 | Interconnect structure with air-gaps | Tai-I Yang, Cheng-Chi Chuang, Tien-Lu Lin | 2022-11-08 |
| 11402157 | Lattice boiler evaporator | Cheng-Wen Hsieh, Wen-Neng Liao, Jau-Han Ke | 2022-08-02 |
| 11379021 | Heat dissipation module | Cheng-Wen Hsieh, Wen-Neng Liao | 2022-07-05 |
| 11302792 | Fabrication of gate all around device | Yu-Chieh Liao, Tai-I Yang, Hsin-Ping Chen | 2022-04-12 |
| 11245034 | Semiconductor device and manufacturing method thereof | Kuei-Ming Chang, Ta-Chun Lin, Rei-Jay Hsieh, Wen-Huei Guo, Kuo-Hua Pan +1 more | 2022-02-08 |