Issued Patents 2022
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11502196 | Stress modulation for dielectric layers | Chung-Ting Ko, Han-Chi Lin, Chunyao Wang, Ching-Yu Huang, Yung-Chih Wang | 2022-11-15 |
| 11482411 | Semiconductor device and method | Ching-Yu Chang, Jei-Ming Chen | 2022-10-25 |
| 11441221 | Method of performing atomic layer deposition | Po-Hsien Cheng, Chung-Ting Ko, Tsung-Hsun Yu, Chi On Chui | 2022-09-13 |
| 11437515 | Source and drain stressors with recessed top surfaces | Kun-Mu Li, Tsz-Mei Kwok, Hsueh-Chang Sung, Chii-Horng Li | 2022-09-06 |
| 11437277 | Forming isolation regions for separating fins and gate stacks | Chung-Ting Ko, Tai-Chun Huang, Jr-Hung Li, Chi On Chui | 2022-09-06 |
| 11411109 | MOS devices having epitaxy regions with reduced facets | Hsueh-Chang Sung, Kun-Mu Li, Chii-Horng Li, Tsz-Mei Kwok | 2022-08-09 |
| 11395373 | Wafer holder with tapered region | Yi-Hung Lin, Li-Ting Wang | 2022-07-19 |
| 11393674 | Forming low-stress silicon nitride layer through hydrogen treatment | Wei-Che Hsieh, Ching-Yu Huang, Hsin-Hao Yeh, Chunyao Wang | 2022-07-19 |
| 11373947 | Methods of forming interconnect structures of semiconductor device | Chia-Cheng Chou, Chung-Chi Ko | 2022-06-28 |
| 11342444 | Dielectric spacer to prevent contacting shorting | Ting-Gang Chen, Tai-Chun Huang, Ming-Chang Wen, Shu-Yuan Ku, Fu-Kai Yang +2 more | 2022-05-24 |
| 11328952 | Interconnect structure and method | Chia-Cheng Chou, Chih-Chien Chi, Chung-Chi Ko, Yao-Jen Chang, Chen-Yuan Kao +3 more | 2022-05-10 |
| 11289417 | Semiconductor device and methods of forming the same | Pei-Yu Chou, Jr-Hung Li, Liang-Yin Chen, Su-Hao Liu, Meng-Han Chou +4 more | 2022-03-29 |
| 11282742 | Semiconductor device with multi-layer etch stop structure and method for forming the same | Po-Cheng Shih, Jen Hung Wang, Yu-Kai Lin, Su-Jen Sung | 2022-03-22 |
| 11282712 | Method for preventing bottom layer wrinkling in a semiconductor device | Jung-Hau Shiu, Chung-Chi Ko, Yu-Yun Peng | 2022-03-22 |
| 11271083 | Semiconductor device, FinFET device and methods of forming the same | Po-Hsien Cheng, Jr-Hung Li, Tai-Chun Huang, Chung-Ting Ko, Jr-Yu Chen +1 more | 2022-03-08 |
| 11257951 | Method of making semiconductor device having first and second epitaxial materials | Lilly Su, Chii-Horng Li, Ming-Hua Yu, Pang-Yen Tsai, Yen-Ru Lee | 2022-02-22 |
| 11244822 | Apparatus for manufacturing a thin film and a method therefor | Tsai-Fu Hsiao, Kuang-Yuan Hsu, Pei-Ren Jeng | 2022-02-08 |
| 11239310 | Seamless gap fill | Yen-Chun Huang, Bor Chiuan Hsieh, Pei-Ren Jeng, Tai-Chun Huang | 2022-02-01 |