Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11482493 | Methods for reducing dual damascene distortion | Chao-Chun Wang, Chung-Chi Ko | 2022-10-25 |
| 11417602 | Semiconductor device having an extra low-k dielectric layer and method of forming the same | Chia-Cheng Chou, Li Chun Te | 2022-08-16 |
| 11374127 | Multi-layer film device and method | Yao-Jen Chang, Chih-Chien Chi, Chen-Yuan Kao, Hung-Wen Su, Kai-Shiang Kuo +1 more | 2022-06-28 |
| 11328952 | Interconnect structure and method | Chia-Cheng Chou, Chih-Chien Chi, Chung-Chi Ko, Yao-Jen Chang, Chen-Yuan Kao +3 more | 2022-05-10 |
| 11282742 | Semiconductor device with multi-layer etch stop structure and method for forming the same | Tze-Liang Lee, Jen Hung Wang, Yu-Kai Lin, Su-Jen Sung | 2022-03-22 |