Issued Patents 2022
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11535950 | Electro-plating and apparatus for performing the same | Chen-Yuan Kao, Minghsing Tsai | 2022-12-27 |
| 11527411 | Interconnect structure having a carbon-containing barrier layer | Rueijer Lin, Ya-Lien Lee, Chun-Chieh Lin | 2022-12-13 |
| 11527476 | Interconnect structure of semiconductor device | Yao-Min Liu, Chia-Pang Kuo, Chien-Chung Huang, Chih-Yi Chang, Ya-Lien Lee +2 more | 2022-12-13 |
| 11430692 | Thermally stable copper-alloy adhesion layer for metal interconnect structures and methods for forming the same | Cheng-Lun Tsai, Huei-Wen Hsieh, Chun-Sheng Chen, Kai-Shiang Kuo, Jen-Wei Liu +2 more | 2022-08-30 |
| 11380542 | Selective capping processes and structures formed thereby | Chih-Chien Chi, Pei-Hsuan Lee, Hsiao-Kuan Wei, Jui-Fen Chien, Hsin-Yun Hsu | 2022-07-05 |
| 11374127 | Multi-layer film device and method | Yao-Jen Chang, Chih-Chien Chi, Chen-Yuan Kao, Kai-Shiang Kuo, Po-Cheng Shih +1 more | 2022-06-28 |
| 11345991 | Semiconductor device, method and machine of manufacture | Jen-Chun Wang, Ya-Lien Lee, Chih-Chien Chi | 2022-05-31 |