Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527411 | Interconnect structure having a carbon-containing barrier layer | Rueijer Lin, Chun-Chieh Lin, Hung-Wen Su | 2022-12-13 |
| 11527476 | Interconnect structure of semiconductor device | Yao-Min Liu, Chia-Pang Kuo, Chien-Chung Huang, Chih-Yi Chang, Chun-Chieh Lin +2 more | 2022-12-13 |
| 11398406 | Selective deposition of metal barrier in damascene processes | Chia-Pang Kuo, Chieh-Yi Shen | 2022-07-26 |
| 11362035 | Diffusion barrier layer for conductive via to decrease contact resistance | Hsiu-Wen Hsueh, Chii-Ping Chen, Neng-Jye Yang, An-Jiao Fu, Ya-Ching Tseng | 2022-06-14 |
| 11345991 | Semiconductor device, method and machine of manufacture | Jen-Chun Wang, Chih-Chien Chi, Hung-Wen Su | 2022-05-31 |