Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11410926 | E-fuse enhancement by underlayer layout design | An-Jiao Fu, Po-Hsiang Huang, Derek Hsen Dai Hsu, Meng-Sheng Chang | 2022-08-09 |
| 11362035 | Diffusion barrier layer for conductive via to decrease contact resistance | Chii-Ping Chen, Neng-Jye Yang, Ya-Lien Lee, An-Jiao Fu, Ya-Ching Tseng | 2022-06-14 |
| 11342222 | Self-aligned scheme for semiconductor device and method of forming the same | Cai-Ling Wu, Ya-Ching Tseng, Chii-Ping Chen, Neng-Jye Yang | 2022-05-24 |
| 11217482 | Method for forming semiconductor device with resistive element | Wen-Sheh Huang, Yu-Hsiang Chen, Chii-Ping Chen | 2022-01-04 |