Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11398380 | Method and structure of middle layer removal | Nai-Chia Chen, Wan Hsuan Hsu, Chia-Wei Wu, Chun-Li Chou | 2022-07-26 |
| 11378882 | Chemical composition for tri-layer removal | Li-Min Chen, Kuo-Bin Huang, Chia-Wei Wu, Jian-Jou Lian | 2022-07-05 |
| 11362035 | Diffusion barrier layer for conductive via to decrease contact resistance | Hsiu-Wen Hsueh, Chii-Ping Chen, Ya-Lien Lee, An-Jiao Fu, Ya-Ching Tseng | 2022-06-14 |
| 11342222 | Self-aligned scheme for semiconductor device and method of forming the same | Hsiu-Wen Hsueh, Cai-Ling Wu, Ya-Ching Tseng, Chii-Ping Chen | 2022-05-24 |
| 11335589 | Semiconductor device and method of manufacture | Yao-Wen Hsu, Ming-Che Ku, Yu-Wen Wang | 2022-05-17 |