Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11398380 | Method and structure of middle layer removal | Nai-Chia Chen, Chia-Wei Wu, Neng-Jye Yang, Chun-Li Chou | 2022-07-26 |
| 11282750 | Contact structure and method of fabricating the same | I-Hsiu Wang, Yean-Zhaw Chen, Cheng-Wei Chang, Yu-Shih Wang, Hsin-Yan Lu +1 more | 2022-03-22 |