Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11404369 | Semiconductor device structure with resistive element | Wan-Te Chen, Chung-Hui Chen, Wei-Chih Chen, Wen-Sheh Huang, Bi-Ling Lin +1 more | 2022-08-02 |
| 11362035 | Diffusion barrier layer for conductive via to decrease contact resistance | Hsiu-Wen Hsueh, Neng-Jye Yang, Ya-Lien Lee, An-Jiao Fu, Ya-Ching Tseng | 2022-06-14 |
| 11355410 | Thermal dissipation in semiconductor devices | Wen-Sheh Huang, Yu-Hsiang Chen | 2022-06-07 |
| 11342222 | Self-aligned scheme for semiconductor device and method of forming the same | Hsiu-Wen Hsueh, Cai-Ling Wu, Ya-Ching Tseng, Neng-Jye Yang | 2022-05-24 |
| 11217482 | Method for forming semiconductor device with resistive element | Wen-Sheh Huang, Hsiu-Wen Hsueh, Yu-Hsiang Chen | 2022-01-04 |