Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532548 | Nitrogen plasma treatment for improving interface between etch stop layer and copper interconnect | Hui-Chun LEE, Po-Hsiang Huang, Jen Hung Wang, Su-Jen Sung, Chih-Chien Chi +1 more | 2022-12-20 |
| 11437313 | Structure and method of forming a semiconductor device with resistive elements | Hong-Wei Chan, Yung-Shih Cheng | 2022-09-06 |
| 11404369 | Semiconductor device structure with resistive element | Wan-Te Chen, Chung-Hui Chen, Wei-Chih Chen, Chii-Ping Chen, Bi-Ling Lin +1 more | 2022-08-02 |
| 11355410 | Thermal dissipation in semiconductor devices | Yu-Hsiang Chen, Chii-Ping Chen | 2022-06-07 |
| 11217482 | Method for forming semiconductor device with resistive element | Hsiu-Wen Hsueh, Yu-Hsiang Chen, Chii-Ping Chen | 2022-01-04 |