Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532548 | Nitrogen plasma treatment for improving interface between etch stop layer and copper interconnect | Hui-Chun LEE, Po-Hsiang Huang, Wen-Sheh Huang, Jen Hung Wang, Su-Jen Sung +1 more | 2022-12-20 |
| 11380542 | Selective capping processes and structures formed thereby | Pei-Hsuan Lee, Hung-Wen Su, Hsiao-Kuan Wei, Jui-Fen Chien, Hsin-Yun Hsu | 2022-07-05 |
| 11374127 | Multi-layer film device and method | Yao-Jen Chang, Chen-Yuan Kao, Hung-Wen Su, Kai-Shiang Kuo, Po-Cheng Shih +1 more | 2022-06-28 |
| 11345991 | Semiconductor device, method and machine of manufacture | Jen-Chun Wang, Ya-Lien Lee, Hung-Wen Su | 2022-05-31 |
| 11328952 | Interconnect structure and method | Chia-Cheng Chou, Chung-Chi Ko, Yao-Jen Chang, Chen-Yuan Kao, Kai-Shiang Kuo +3 more | 2022-05-10 |