Issued Patents 2022
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11535950 | Electro-plating and apparatus for performing the same | Hung-Wen Su, Minghsing Tsai | 2022-12-27 |
| 11532561 | Different via configurations for different via interface requirements | Shih-Che Lin, Po-Yu Huang, Chao-Hsun Wang, Kuo-Yi Chao, Mei-Yun Wang +3 more | 2022-12-20 |
| 11532717 | Forming metal contacts on metal gates | Chao-Hsun Wang, Yu-Feng Yin, Kuo-Yi Chao, Mei-Yun Wang, Feng-Yu Chang | 2022-12-20 |
| 11374127 | Multi-layer film device and method | Yao-Jen Chang, Chih-Chien Chi, Hung-Wen Su, Kai-Shiang Kuo, Po-Cheng Shih +1 more | 2022-06-28 |
| 11328952 | Interconnect structure and method | Chia-Cheng Chou, Chih-Chien Chi, Chung-Chi Ko, Yao-Jen Chang, Kai-Shiang Kuo +3 more | 2022-05-10 |
| 11271112 | Method for forming fin field effect transistor (FINFET) device structure with conductive layer between gate and gate contact | Chao-Hsun Wang, Kuo-Yi Chao, Rueijer Lin, Mei-Yun Wang | 2022-03-08 |