Issued Patents 2022
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532717 | Forming metal contacts on metal gates | Yu-Feng Yin, Kuo-Yi Chao, Mei-Yun Wang, Feng-Yu Chang, Chen-Yuan Kao | 2022-12-20 |
| 11532561 | Different via configurations for different via interface requirements | Shih-Che Lin, Po-Yu Huang, Kuo-Yi Chao, Mei-Yun Wang, Feng-Yu Chang +3 more | 2022-12-20 |
| 11527614 | Semiconductor structure with conductive structure and method for manufacturing the same | Jia-Heng Wang, Pang-Chi Wu, Fu-Kai Yang, Mei-Yun Wang | 2022-12-13 |
| 11508822 | Source/drain via having reduced resistance | Po-Yu Huang, Shih-Che Lin, Kuo-Yi Chao, Mei-Yun Wang | 2022-11-22 |
| 11430691 | Polishing interconnect structures in semiconductor devices | Pang-Sheng Chang, Kuo-Yi Chao, Fu-Kai Yang, Mei-Yun Wang, Li-Chieh Wu +1 more | 2022-08-30 |
| 11348830 | Method of forming trenches with different depths | Hsien-Cheng Wang, Mei-Yun Wang | 2022-05-31 |
| 11322394 | Contact formation method and related structure | Wang-Jung Hsueh, Kuo-Yi Chao, Mei-Yun Wang | 2022-05-03 |
| 11271112 | Method for forming fin field effect transistor (FINFET) device structure with conductive layer between gate and gate contact | Kuo-Yi Chao, Rueijer Lin, Chen-Yuan Kao, Mei-Yun Wang | 2022-03-08 |
| 11227830 | Conductive features having varying resistance | Jia-En Lee, Po-Yu Huang, Shih-Che Lin, Kuo-Yi Chao, Mei-Yun Wang +1 more | 2022-01-18 |
| 11227950 | Methods of forming air spacers in semiconductor devices | Chen-Ming Lee, Kuo-Yi Chao, Mei-Yun Wang, Pei-Yu Chou, Kuo-Ju Chen | 2022-01-18 |