Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532514 | Structure and formation method of semiconductor device with conductive feature | Kuo-Hsiu Wei, Kei-Wei Chen, Tang-Kuei Chang, Chia Hsuan Lee, Jian-Ci Lin | 2022-12-20 |
| 11508585 | Methods for chemical mechanical polishing and forming interconnect structure | Ji Cui, Fu-Ming Huang, Ting-Kui Chang, Tang-Kuei Chang, Chun-Chieh Lin +7 more | 2022-11-22 |
| 11482450 | Methods of forming an abrasive slurry and methods for chemical- mechanical polishing | Chia Hsuan Lee, Chun-Wei Hsu, Chia-Wei Ho, Chi-Hsiang Shen, Jian-Ci Lin +6 more | 2022-10-25 |
| 11430691 | Polishing interconnect structures in semiconductor devices | Pang-Sheng Chang, Chao-Hsun Wang, Kuo-Yi Chao, Fu-Kai Yang, Mei-Yun Wang +1 more | 2022-08-30 |
| 11410846 | Method for metal gate surface clean | Shich-Chang Suen, Chi-Jen Liu, He Hui Peng, Liang-Guang Chen, Yung-Chung Chen | 2022-08-09 |