Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508585 | Methods for chemical mechanical polishing and forming interconnect structure | Ji Cui, Fu-Ming Huang, Ting-Kui Chang, Tang-Kuei Chang, Chun-Chieh Lin +7 more | 2022-11-22 |
| 11482450 | Methods of forming an abrasive slurry and methods for chemical- mechanical polishing | Chia Hsuan Lee, Chun-Wei Hsu, Chia-Wei Ho, Li-Chieh Wu, Jian-Ci Lin +6 more | 2022-10-25 |