Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508585 | Methods for chemical mechanical polishing and forming interconnect structure | Ji Cui, Fu-Ming Huang, Tang-Kuei Chang, Chun-Chieh Lin, Wei-Wei Liang +7 more | 2022-11-22 |
| 11322345 | Post-CMP cleaning and apparatus | Fu-Ming Huang, Liang-Guang Chen, Chun-Chieh Lin | 2022-05-03 |