Issued Patents 2022
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532282 | Displays with reduced temperature luminance sensitivity | Shinya Ono, Chin-Wei Lin, Zino Lee, Chen-Ming Chen | 2022-12-20 |
| 11527411 | Interconnect structure having a carbon-containing barrier layer | Rueijer Lin, Ya-Lien Lee, Hung-Wen Su | 2022-12-13 |
| 11527476 | Interconnect structure of semiconductor device | Yao-Min Liu, Chia-Pang Kuo, Chien-Chung Huang, Chih-Yi Chang, Ya-Lien Lee +2 more | 2022-12-13 |
| 11508585 | Methods for chemical mechanical polishing and forming interconnect structure | Ji Cui, Fu-Ming Huang, Ting-Kui Chang, Tang-Kuei Chang, Wei-Wei Liang +7 more | 2022-11-22 |
| 11430692 | Thermally stable copper-alloy adhesion layer for metal interconnect structures and methods for forming the same | Cheng-Lun Tsai, Huei-Wen Hsieh, Chun-Sheng Chen, Kai-Shiang Kuo, Jen-Wei Liu +2 more | 2022-08-30 |
| 11380762 | Semiconductor device having semiconductor alloy layer adjacent a gate structure | Chien-Chao Huang, Yee-Chia Yeo, Chao-Hsiung Wang, Chenming Hu | 2022-07-05 |
| 11349414 | Apparatus and method for monitoring the relative relationship between the wafer and the chuck | Te-Min Wang, Yu-Ho Ni, Chien-Chung Hou, Cheng-Mao Chien | 2022-05-31 |
| 11322345 | Post-CMP cleaning and apparatus | Fu-Ming Huang, Liang-Guang Chen, Ting-Kui Chang | 2022-05-03 |