Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508585 | Methods for chemical mechanical polishing and forming interconnect structure | Ji Cui, Fu-Ming Huang, Ting-Kui Chang, Tang-Kuei Chang, Chun-Chieh Lin +7 more | 2022-11-22 |
| 11450565 | Ion implant process for defect elimination in metal layer planarization | Chia-Cheng Chen, Huicheng Chang, Fu-Ming Huang, Kei-Wei Chen, Liang-Yin Chen +3 more | 2022-09-20 |