Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508585 | Methods for chemical mechanical polishing and forming interconnect structure | Ji Cui, Ting-Kui Chang, Tang-Kuei Chang, Chun-Chieh Lin, Wei-Wei Liang +7 more | 2022-11-22 |
| 11450565 | Ion implant process for defect elimination in metal layer planarization | Chia-Cheng Chen, Huicheng Chang, Kei-Wei Chen, Liang-Yin Chen, Tang-Kuei Chang +3 more | 2022-09-20 |
| 11322345 | Post-CMP cleaning and apparatus | Liang-Guang Chen, Ting-Kui Chang, Chun-Chieh Lin | 2022-05-03 |