Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532514 | Structure and formation method of semiconductor device with conductive feature | Li-Chieh Wu, Kuo-Hsiu Wei, Kei-Wei Chen, Chia Hsuan Lee, Jian-Ci Lin | 2022-12-20 |
| 11508585 | Methods for chemical mechanical polishing and forming interconnect structure | Ji Cui, Fu-Ming Huang, Ting-Kui Chang, Chun-Chieh Lin, Wei-Wei Liang +7 more | 2022-11-22 |
| 11450565 | Ion implant process for defect elimination in metal layer planarization | Chia-Cheng Chen, Huicheng Chang, Fu-Ming Huang, Kei-Wei Chen, Liang-Yin Chen +3 more | 2022-09-20 |