Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532514 | Structure and formation method of semiconductor device with conductive feature | Li-Chieh Wu, Kuo-Hsiu Wei, Kei-Wei Chen, Tang-Kuei Chang, Jian-Ci Lin | 2022-12-20 |
| 11482450 | Methods of forming an abrasive slurry and methods for chemical- mechanical polishing | Chun-Wei Hsu, Chia-Wei Ho, Chi-Hsiang Shen, Li-Chieh Wu, Jian-Ci Lin +6 more | 2022-10-25 |