Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532561 | Different via configurations for different via interface requirements | Shih-Che Lin, Po-Yu Huang, Chao-Hsun Wang, Kuo-Yi Chao, Mei-Yun Wang +3 more | 2022-12-20 |
| 11527411 | Interconnect structure having a carbon-containing barrier layer | Ya-Lien Lee, Chun-Chieh Lin, Hung-Wen Su | 2022-12-13 |
| 11271112 | Method for forming fin field effect transistor (FINFET) device structure with conductive layer between gate and gate contact | Chao-Hsun Wang, Kuo-Yi Chao, Chen-Yuan Kao, Mei-Yun Wang | 2022-03-08 |