Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11430692 | Thermally stable copper-alloy adhesion layer for metal interconnect structures and methods for forming the same | Huei-Wen Hsieh, Chun-Sheng Chen, Kai-Shiang Kuo, Jen-Wei Liu, Cheng-Hui Weng +2 more | 2022-08-30 |
| 11253783 | Method for training AI bot in computer game | Chiu-Chou Lin, Ying-Hau Wu, Kuan-Ming Lin, PeiWen Huang, I-Chen Wu | 2022-02-22 |