Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11430692 | Thermally stable copper-alloy adhesion layer for metal interconnect structures and methods for forming the same | Cheng-Lun Tsai, Huei-Wen Hsieh, Chun-Sheng Chen, Jen-Wei Liu, Cheng-Hui Weng +2 more | 2022-08-30 |
| 11374127 | Multi-layer film device and method | Yao-Jen Chang, Chih-Chien Chi, Chen-Yuan Kao, Hung-Wen Su, Po-Cheng Shih +1 more | 2022-06-28 |
| 11328952 | Interconnect structure and method | Chia-Cheng Chou, Chih-Chien Chi, Chung-Chi Ko, Yao-Jen Chang, Chen-Yuan Kao +3 more | 2022-05-10 |