Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11417602 | Semiconductor device having an extra low-k dielectric layer and method of forming the same | Po-Cheng Shih, Li Chun Te | 2022-08-16 |
| 11373947 | Methods of forming interconnect structures of semiconductor device | Chung-Chi Ko, Tze-Liang Lee | 2022-06-28 |
| 11328952 | Interconnect structure and method | Chih-Chien Chi, Chung-Chi Ko, Yao-Jen Chang, Chen-Yuan Kao, Kai-Shiang Kuo +3 more | 2022-05-10 |