Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527476 | Interconnect structure of semiconductor device | Yao-Min Liu, Chia-Pang Kuo, Chih-Yi Chang, Ya-Lien Lee, Chun-Chieh Lin +2 more | 2022-12-13 |
| 11411176 | Gradient protection layer in MTJ manufacturing | Tai-Yen Peng, Yu-Shu Chen, Sin-Yi Yang, Chen-Jung Wang, Han-Ting Lin +2 more | 2022-08-09 |
| 11271150 | Integrated circuit | Tai-Yen Peng, Yu-Shu Chen, Sin-Yi Yang, Chen-Jung Wang, Han-Ting Lin +3 more | 2022-03-08 |