Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532548 | Nitrogen plasma treatment for improving interface between etch stop layer and copper interconnect | Po-Hsiang Huang, Wen-Sheh Huang, Jen Hung Wang, Su-Jen Sung, Chih-Chien Chi +1 more | 2022-12-20 |
| 11417512 | Method for cleaning semiconductor wafer backside surface by hybrid brush assembly | Hsuan-Ying MAI | 2022-08-16 |