Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532548 | Nitrogen plasma treatment for improving interface between etch stop layer and copper interconnect | Hui-Chun LEE, Po-Hsiang Huang, Wen-Sheh Huang, Jen Hung Wang, Chih-Chien Chi +1 more | 2022-12-20 |
| 11515255 | Electro-migration barrier for interconnect | Chih-Chiang Chang, Chia-Ho Chen | 2022-11-29 |
| 11502035 | Interconnect structure and method of forming same | — | 2022-11-15 |
| 11282742 | Semiconductor device with multi-layer etch stop structure and method for forming the same | Po-Cheng Shih, Tze-Liang Lee, Jen Hung Wang, Yu-Kai Lin | 2022-03-22 |
| 11264328 | Capping layer for improved deposition selectivity | Chao-Chun Wang | 2022-03-01 |