Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11355399 | Gap patterning for metal-to-source/drain plugs in a semiconductor device | Yu-Lien Huang, Ching-Feng Fu, Huan-Just Lin, Fu-Sheng Li, Tsai-Jung Ho +2 more | 2022-06-07 |
| 11239310 | Seamless gap fill | Yen-Chun Huang, Pei-Ren Jeng, Tai-Chun Huang, Tze-Liang Lee | 2022-02-01 |