Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532479 | Cut metal gate refill with void | Wan-Hsien Lin, Chieh-Ping Wang, Tai-Chun Huang, Chi On Chui | 2022-12-20 |
| 11495464 | Semiconductor device and method | Ya-Lan Chang, Tai-Chun Huang, Chi On Chui, Yung-Cheng Lu | 2022-11-08 |
| 11348917 | Semiconductor device with isolation structure | Chieh-Ping Wang, Tai-Chun Huang, Yung-Cheng Lu, Chi On Chui | 2022-05-31 |
| 11342444 | Dielectric spacer to prevent contacting shorting | Tai-Chun Huang, Ming-Chang Wen, Shu-Yuan Ku, Fu-Kai Yang, Tze-Liang Lee +2 more | 2022-05-24 |
| 11335603 | Multi-layered insulating film stack | Chieh-Ping Wang, Bo-Cyuan Lu, Tai-Chun Huang, Chi On Chui | 2022-05-17 |