Issued Patents 2022
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11530479 | Atomic layer deposition tool and method | Chung-Ting Ko, Wen-Ju Chen, Wan-Chen Hsieh, Ming-Fa Wu, Tai-Chun Huang +1 more | 2022-12-20 |
| 11529712 | CMP polishing head design for improving removal rate uniformity | Te-Chien Hou, Ching-Hong Jiang, Kuo-Yin Lin, Ming-Shiuan She, Shen-Nan Lee +1 more | 2022-12-20 |
| 11527653 | Semiconductor device and method of manufacture | Wan-Yi Kao, Yu-Cheng Shiau, Chunyao Wang, Chih-Tang Peng, Chi On Chui | 2022-12-13 |
| 11495464 | Semiconductor device and method | Ya-Lan Chang, Ting-Gang Chen, Tai-Chun Huang, Chi On Chui | 2022-11-08 |
| 11469229 | Semiconductor device and method | Wan-Yi Kao, Szu-Ping Lee, Che-Hao Chang, Chun-Heng Chen, Chi On Chui | 2022-10-11 |
| 11444177 | Semiconductor device and method | Wen-Kai Lin, Che-Hao Chang, Chi On Chui | 2022-09-13 |
| 11437492 | Semiconductor device and method of manufacture | Wan-Yi Kao, Hung-Cheng Lin, Che-Hao Chang, Chi On Chui | 2022-09-06 |
| 11348917 | Semiconductor device with isolation structure | Chieh-Ping Wang, Tai-Chun Huang, Ting-Gang Chen, Chi On Chui | 2022-05-31 |
| 11342444 | Dielectric spacer to prevent contacting shorting | Ting-Gang Chen, Tai-Chun Huang, Ming-Chang Wen, Shu-Yuan Ku, Fu-Kai Yang +2 more | 2022-05-24 |
| 11316034 | Post-formation mends of dielectric features | Wan-Yi Kao, Hung-Cheng Lin, Che-Hao Chang, Chi On Chui | 2022-04-26 |
| 11227788 | Method of forming isolation layer | Teng-Chun Tsai, Bing Chen, Chien-Hsun Wang, Cheng-Tung Lin, Chih-Tang Peng +3 more | 2022-01-18 |