Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532479 | Cut metal gate refill with void | Ting-Gang Chen, Wan-Hsien Lin, Tai-Chun Huang, Chi On Chui | 2022-12-20 |
| 11348917 | Semiconductor device with isolation structure | Tai-Chun Huang, Yung-Cheng Lu, Ting-Gang Chen, Chi On Chui | 2022-05-31 |
| 11335603 | Multi-layered insulating film stack | Ting-Gang Chen, Bo-Cyuan Lu, Tai-Chun Huang, Chi On Chui | 2022-05-17 |