Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11529712 | CMP polishing head design for improving removal rate uniformity | Ching-Hong Jiang, Kuo-Yin Lin, Ming-Shiuan She, Shen-Nan Lee, Teng-Chun Tsai +1 more | 2022-12-20 |
| 11389928 | Method for conditioning polishing pad | Shen-Nan Lee, Teng-Chun Tsai, Chung-Wei Hsu, Chen-Hao Wu | 2022-07-19 |