Issued Patents 2022
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11529712 | CMP polishing head design for improving removal rate uniformity | Te-Chien Hou, Ching-Hong Jiang, Kuo-Yin Lin, Ming-Shiuan She, Teng-Chun Tsai +1 more | 2022-12-20 |
| 11525072 | Materials and methods for chemical mechanical polishing of ruthenium-containing materials | An-Hsuan Lee, Chen-Hao Wu, Chun-Hung Liao, Teng-Chun Tsai, Huang-Lin Chao | 2022-12-13 |
| 11495471 | Slurry compositions for chemical mechanical planarization | An-Hsuan Lee, Chun-Hung Liao, Chen-Hao Wu, Teng-Chun Tsai, Huang-Lin Chao | 2022-11-08 |
| 11389928 | Method for conditioning polishing pad | Te-Chien Hou, Teng-Chun Tsai, Chung-Wei Hsu, Chen-Hao Wu | 2022-07-19 |
| 11312882 | CMP slurry solution for hardened fluid material | Kuo-Yin Lin, Wen-Kuei Liu, Teng-Chun Tsai, Kuo-Cheng Lien, Chang-Sheng Lin +1 more | 2022-04-26 |
| 11267987 | Chemical mechanical polishing slurry composition and method of polishing metal layer | Chun-Hung Liao, An-Hsuan Lee, Teng-Chun Tsai, Chen-Hao Wu, Huang-Lin Chao | 2022-03-08 |