Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11529712 | CMP polishing head design for improving removal rate uniformity | Te-Chien Hou, Ching-Hong Jiang, Ming-Shiuan She, Shen-Nan Lee, Teng-Chun Tsai +1 more | 2022-12-20 |
| 11312882 | CMP slurry solution for hardened fluid material | Wen-Kuei Liu, Teng-Chun Tsai, Shen-Nan Lee, Kuo-Cheng Lien, Chang-Sheng Lin +1 more | 2022-04-26 |