Issued Patents 2022
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11529712 | CMP polishing head design for improving removal rate uniformity | Te-Chien Hou, Ching-Hong Jiang, Kuo-Yin Lin, Ming-Shiuan She, Shen-Nan Lee +1 more | 2022-12-20 |
| 11525072 | Materials and methods for chemical mechanical polishing of ruthenium-containing materials | An-Hsuan Lee, Shen-Nan Lee, Chen-Hao Wu, Chun-Hung Liao, Huang-Lin Chao | 2022-12-13 |
| 11508583 | Selective high-k formation in gate-last process | Yasutoshi Okuno, Ziwei Fang, Fu-Ting Yen | 2022-11-22 |
| 11495471 | Slurry compositions for chemical mechanical planarization | An-Hsuan Lee, Chun-Hung Liao, Chen-Hao Wu, Shen-Nan Lee, Huang-Lin Chao | 2022-11-08 |
| 11444028 | Contact structure and formation thereof | Hong-Mao Lee, Huicheng Chang, Chia-Han Lai, Chi-Hsuan Ni, Cheng-Tung Lin +4 more | 2022-09-13 |
| 11398381 | Method for forming semiconductor structure | Chia-Wei Su, Fu-Ting Yen | 2022-07-26 |
| 11389928 | Method for conditioning polishing pad | Shen-Nan Lee, Te-Chien Hou, Chung-Wei Hsu, Chen-Hao Wu | 2022-07-19 |
| 11387138 | Integrated circuit isolation feature and method of forming the same | Chih-Tang Peng, Shuen-Shin Liang, Keng-Chu Lin | 2022-07-12 |
| 11312882 | CMP slurry solution for hardened fluid material | Kuo-Yin Lin, Wen-Kuei Liu, Shen-Nan Lee, Kuo-Cheng Lien, Chang-Sheng Lin +1 more | 2022-04-26 |
| 11267987 | Chemical mechanical polishing slurry composition and method of polishing metal layer | Chun-Hung Liao, An-Hsuan Lee, Shen-Nan Lee, Chen-Hao Wu, Huang-Lin Chao | 2022-03-08 |
| 11264485 | Spacer structure for semiconductor device | Chen-Han Wang, Ding-Kang Shih, Chun-Hsiung Lin, Zhi-Chang Lin, Akira Mineji +1 more | 2022-03-01 |
| 11227788 | Method of forming isolation layer | Bing Chen, Chien-Hsun Wang, Cheng-Tung Lin, Chih-Tang Peng, De-Fang Chen +3 more | 2022-01-18 |