Issued Patents 2022
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11502166 | Seal material for air gaps in semiconductor devices | Shuen-Shin Liang, Keng-Chu Lin, Tetsuji Ueno, Ting-Ting Chen | 2022-11-15 |
| 11480606 | In-line device electrical property estimating method and test structure of the same | Chun-Hsiung Lin | 2022-10-25 |
| 11430891 | Gate all around structure with additional silicon layer and method for forming the same | Pei-Hsun Wang, Chun-Hsiung Lin, Chih-Hao Wang | 2022-08-30 |
| 11296187 | Seal material for air gaps in semiconductor devices | Shuen-Shin Liang, Keng-Chu Lin, Tetsuji Ueno, Ting-Ting Chen | 2022-04-05 |
| 11264485 | Spacer structure for semiconductor device | Ding-Kang Shih, Chun-Hsiung Lin, Teng-Chun Tsai, Zhi-Chang Lin, Akira Mineji +1 more | 2022-03-01 |
| 11257753 | Interconnect structure and method for manufacturing the interconnect structure | KHADERBAD MRUNAL ABHIJITH, Yu-Yun Peng, Fu-Ting Yen, Tsu-Hsiu Perng, Keng-Chu Lin | 2022-02-22 |