Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11502166 | Seal material for air gaps in semiconductor devices | Shuen-Shin Liang, Chen-Han Wang, Keng-Chu Lin, Tetsuji Ueno | 2022-11-15 |
| 11296187 | Seal material for air gaps in semiconductor devices | Shuen-Shin Liang, Chen-Han Wang, Keng-Chu Lin, Tetsuji Ueno | 2022-04-05 |