Issued Patents 2022
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11522074 | Semiconductor device and manufacturing method thereof | Kuo-Cheng Ching, Kuan-Lun Cheng, Chih-Hao Wang, Shi Ning Ju | 2022-12-06 |
| 11521929 | Capping layer for liner-free conductive structures | Shuen-Shin Liang, Chun-I Tsai, Chih-Wei Chang, Chun-Hsien Huang, Hung-Yi Huang +4 more | 2022-12-06 |
| 11512246 | Luminescent material and electronic device having a display function using the same | Yuan-Ren Juang, Szu-Chun Yu, Wei Chen, Yao-Tsung Chuang, Jen-Shrong Uen | 2022-11-29 |
| 11502166 | Seal material for air gaps in semiconductor devices | Shuen-Shin Liang, Chen-Han Wang, Tetsuji Ueno, Ting-Ting Chen | 2022-11-15 |
| 11485909 | Red quantum dot, light emitting material and manufacturing method of quantum dot | — | 2022-11-01 |
| 11488869 | Transistor isolation structures | Mrunal A. Khaderbad, Yu-Yun Peng | 2022-11-01 |
| 11476365 | Fin field effect transistor device structure and method for forming the same | Chia-Hung Chu, Sung-Li Wang, Fang-Wei Lee, Jung-Hao Chang, Mrunal A. Khaderbad | 2022-10-18 |
| 11476333 | Dual channel structure | Mrunal A. Khaderbad, Dhanyakumar Mahaveer Sathaiya, Tzer-Min Shen | 2022-10-18 |
| 11404416 | Low resistance fill metal layer material as stressor in metal gates | Mrunal A. Khaderbad, Ziwei Fang, Hsueh Wen Tsau | 2022-08-02 |
| 11393924 | Structure and formation method of semiconductor device with high contact area | Shuen-Shin Liang, Pang-Yen Tsai, Sung-Li Wang, Pinyen Lin | 2022-07-19 |
| 11387138 | Integrated circuit isolation feature and method of forming the same | Chih-Tang Peng, Shuen-Shin Liang, Teng-Chun Tsai | 2022-07-12 |
| 11380781 | Contact and via structures for semiconductor devices | Mrunal A. Khaderbad | 2022-07-05 |
| 11362236 | Quantum dot and manufacturing method for the same and application using the same | Wei Chen | 2022-06-14 |
| 11362212 | Contact interface engineering for reducing contact resistance | Mrunal A. Khaderbad, Sung-Li Wang | 2022-06-14 |
| 11296187 | Seal material for air gaps in semiconductor devices | Shuen-Shin Liang, Chen-Han Wang, Tetsuji Ueno, Ting-Ting Chen | 2022-04-05 |
| 11257753 | Interconnect structure and method for manufacturing the interconnect structure | KHADERBAD MRUNAL ABHIJITH, Yu-Yun Peng, Fu-Ting Yen, Chen-Han Wang, Tsu-Hsiu Perng | 2022-02-22 |
| 11227794 | Method for making self-aligned barrier for metal vias In-Situ during a metal halide pre-clean and associated interconnect structure | Sung-Li Wang, Shuen-Shin Liang, Yu-Yun Peng, Fang-Wei Lee, Chia-Hung Chu +1 more | 2022-01-18 |
| 11217524 | Interconnect structure and manufacturing method for the same | Shuen-Shin Liang, Ken-Yu Chang, Hung-Yi Huang, Chien-Kuo Chang, Chi-Hung Chuang +7 more | 2022-01-04 |