Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11222818 | Formation method of semiconductor device structure with metal-semiconductor compound region | Yi-Hsiang Chao, Min-Hsiu Hung, Chun-Wen Nieh, Ya-Huei Li, Yu-Hsiang Liao +7 more | 2022-01-11 |
| 11217524 | Interconnect structure and manufacturing method for the same | Shuen-Shin Liang, Ken-Yu Chang, Hung-Yi Huang, Chien-Kuo Chang, Kai-Yi Chu +7 more | 2022-01-04 |