Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11521929 | Capping layer for liner-free conductive structures | Shuen-Shin Liang, Chun-I Tsai, Chih-Wei Chang, Chun-Hsien Huang, Hung-Yi Huang +4 more | 2022-12-06 |
| 11257712 | Source/drain contact formation methods and devices | Cheng-Wei Chang, Yu-Ming Huang, Ethan Tseng, Yi-Ying Liu | 2022-02-22 |
| 11217524 | Interconnect structure and manufacturing method for the same | Shuen-Shin Liang, Hung-Yi Huang, Chien-Kuo Chang, Chi-Hung Chuang, Kai-Yi Chu +7 more | 2022-01-04 |