Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11521929 | Capping layer for liner-free conductive structures | Shuen-Shin Liang, Chih-Wei Chang, Chun-Hsien Huang, Hung-Yi Huang, Keng-Chu Lin +4 more | 2022-12-06 |
| 11217524 | Interconnect structure and manufacturing method for the same | Shuen-Shin Liang, Ken-Yu Chang, Hung-Yi Huang, Chien-Kuo Chang, Chi-Hung Chuang +7 more | 2022-01-04 |